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1. 導線（信道）：conduction (track) 2. 導線（體）寬度：conductor width 3. 導線距離：conductor spacing 4. 導線層：conductor layer 5. 導線寬度/間距：conductor line/space 6. 第一導線層：conductor layer No.1 7. 圓形盤：round pad 8. 方形盤：square pad 9. 菱形盤：diamond pad 10. 長方形焊盤：oblong pad 11. 子彈形盤：bullet pad 12. 淚滴盤：teardrop pad 13. 雪人盤：snowman pad 14. V形盤：V-shaped pad 15. 環(huán)形盤：annular pad 16. 非圓形盤：non-circular pad 17. 隔離盤：isolation pad 18. 非功能連接盤：monfunctional pad 19. 偏置連接盤：offset land 20. 腹（背）裸盤：back-bard land 21. 盤址：anchoring spaur 22. 連接盤圖形：land pattern 23. 連接盤網(wǎng)格陣列：land grid array 24. 孔環(huán)：annular ring 25. 組件孔：component hole 26. 安裝孔：mounting hole 27. 支撐孔：supported hole 28. 非支撐孔：unsupported hole 29. 導通孔：via 30. 鍍通孔：plated through hole (PTH) 31. 余隙孔：access hole 32. 盲孔：blind via (hole) 33. 埋孔：buried via hole 34. 埋/盲孔：buried /blind via 35. 任意層內(nèi)部導通孔：any layer inner via hole (ALIVH) 36. 全部鉆孔：all drilled hole 37. 定位孔：toaling hole 38. 無連接盤孔：landless hole 39. 中間孔：interstitial hole 40. 無連接盤導通孔：landless via hole 41. 引導孔：pilot hole 42. 端接全隙孔：terminal clearomee hole 43. 準表面間鍍覆孔：quasi-interfacing plated-through hole 44. 準尺寸孔：dimensioned hole 45. 在連接盤中導通孔：via-in-pad 46. 孔位：hole location 47. 孔密度：hole density 48. 孔圖：hole pattern 49. 鉆孔圖：drill drawing 50. 裝配圖：assembly drawing 51. 印制板組裝圖：printed board assembly drawing 52. 參考基準：datum referan
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